Books
books

[1] 《仪器制造技术》 Fabrication Technology of Instruments, Xinghua Qu, Penghao Hu, Guoxin Jia, Jingbin Guo, Bolei Zhao, Weifu Jia, Ping Wang, and Zheyao Wang, Mechanical Industry Press, 2005.1, ISBN-111-15754-0.

[2] 《微系统设计与制造》 Microsystem Design and Fabrication, Zheyao Wang, Tsinghua University Press, 2008.2, ISBN978-7-302-15196-8.

[3] 《三维集成技术》 Three-dimensional Integration Technology, Zheyao Wang, Tsinghua University Press, 2014.10, ISBN978-7-302-35499-4.

Journal Articles

  • Zheyao Wang, Microsystems using three-dimensional integration and TSV technologies: fundamentals and applications, Microelectronic Engineering,210, 35-64, 2019.

  • Xingjun Xue, Hao Xiong, Zhen Song, Yuxin Du, Dong Wu, Liyang Pan, and Zheyao Wang*, Silicon diode uncooled focal plane array with three-dimensional integrated CMOS readout circuits, IEEE Sensors Journal,19(2) 426-434, 2019.

  • Kun Zhou, Zhida Zhao, Liyang Pan, Zheyao Wang*, Silicon nanowire pH sensors fabricated with CMOS compatible sidewall mask technology, Sensors and Actuators B: Chemical,279, 111-121, 2019.

  • Ziyu Liu, Jian Cai, Qian Wang, Zheyao Wang, Lei Liu, Guisheng Zou, Thermal-stable void-free interface morphology and bonding mechanism of low-temperature Cu-Cu bonding using Ag nanostructure as intermediate, J. Alloys and Compounds,767, 575-582, 2018.

  • Xingjun Xue, Kun Zhou, Jian Cai, Qian Wang, Zheyao Wang. Reactive ion etching of poly (cyclohexene carbonate) in oxygen plasma, Microelectronic Engineering,191, 1-9, 2018.

  • Xingjun Xue, Shujie Yang, Zheyao Wang*, Heat-Depolymerizable Polypropylene Carbonate as a Temporary Bonding Adhesive for Fabrication of Flexible Silicon Sensor Chips, IEEE Transactions on Components, Packaging and Manufacturing Technology,7(11), 1751-1758, 2017.

  • Ke Wu, Zheyao Wang*, High-Frequency Characterization of Through- Silicon-Vias (TSVs) with Benzocyclobutene (BCB) Liners, IEEE Transactions on Components, Packaging and Manufacturing Technology,7(11), 1859-1868, 2017.

  • Qing Ma, Kaitian Huang, Zhanqing Yu, Zheyao Wang*, A MEMS-Based Electric Field Sensor for Measurement of High-Voltage DC Synthetic Fields in Air, IEEE Sensors Journal,17(23), 7866-7876, 2017.

  • Pengcheng Wei, Dongdong Zhang, Minghan Cai, Xiaozeng Song, Zheyao Wang, Lian Duan, Simplified single-emitting-layer hybrid white organic light-emitting diodes with high efficiency, low efficiency roll-off, high color rendering index and superior color stability, Organic Electronics,Organic Electronics.

  • Yong-Sheng Li, Yan Li, Qiu Min, Ke Wu, En-Xiao Liu, Ran Hao, Hong-Sheng Chen, Cheng Zhuo, Wen-Yan Yin, Zhe-Yao Wang, Electromagnetic Characteristics of Multiport TSVs Using L-2L De-Embedding Method and Shielding TSVs, IEEE Trans. Electromagnetic Compatibility,59(5): 1541-1548.

  • Fan Bu, Qing Ma, Zheyao Wang*, Delamination of Bonding Interface Between Benzocyclobutene (BCB) and Silicon Dioxide/Silicon Nitride, Microelectronics Reliability,65(10): 225-233, 2016.

  • Yuxin Du, Dong Wu, Zhen Song, Miao Liu, Sujie Yang, and Zheyao Wang*, Three-dimensional integration of MEMS and CMOS using electroless plated nickel through-MEMS-vias, IEEE J. Microelectromechanical Systems,25(4): 770-779, 2016.

  • Cui Huang, Dong Wu, Zheyao Wang*, Thermal reliability tests of air-gap TSVs with combined air-SiO2 liners, IEEE Trans. Components, Packaging and Manufacturing Technology,6(5): 703–711, 2016

  • Cui Huang, Ke Wu, Zheyao Wang*, Mechanical reliability tests of air-gap through-silicon-vias (TSVs), IEEE Trans. Components, Packaging and Manufacturing Technology,6(5): 712–721, 2016.

  • Xiaowei Li, Chaochao Ren, Zheyao Wang, Pai Zhao, Hongmei Wang, Yuxing Bai, Changes in force associated with the amount of aligner activation and lingual bodily movement of the maxillary central incisor, Korean J Orthod,46(2):65-72, 2016.

  • Cui Huang, Ke Wu, Zheyao Wang*, Low-capacitance through-silicon-vias (TSVs) with combined air/SiO2 liners, IEEE Transactions on Electron Devices,63(2): 739-745, 2016.

  • Yuxin Du, Zhen Song, Huizhong Zhu, and Zheyao Wang*, Fabrication of Ni microbumps with small feature size on Au using electroless Ni plating with noncontact induction, IEEE Trans. Components, Packaging and Manufacturing Technology,5(8): 1169-1177, 2015.

  • Zheyao Wang*, Three-dimensional integration and through-silicon vias (TSVs) in MEMS and microsensors, IEEE J. Microelectromechanical Systems,25(5): 1211-1244, 2015

  • Zhen Song, Zhimin Tan, Litian Liu, Zheyao Wang*, Void-free BCB adhesive wafer bonding with high alignment accuracy, Microsystem Technologies,21(8): 1633-1641, 2015.

  • Cui Huang, Liyang Pan, Ran Liu, Zheyao Wang*, Thermal and electrical reliability tests of air-gap through-silicon vias (TSVs), IEEE Transactions on Device and Materials Reliability,15(1): 90-100, 2015.

  • Zhen Song, Dong Wu, Huizhong Zhu, Litian Liu, Zheyao Wang*, Void-formation in uncured and partially-cured BCB bonding adhesive on patterned surfaces, Microelectronic Engineering,137(2): 164-168, 2015.

  • Cui Huang, Liyang Pan, Ran Liu, Zheyao Wang*, Thermal and electrical properties of BCB-liner through-silicon vias (TSVs), IEEE Trans. Components, Packaging and Manufacturing Technology,4(12): 1936-1946, 2014.

  • Yan Li, Wen Shao, Shouhong Jin, Tuan Xu, Xianli Jiang, Shihchi Yang, Zheyao Wang, Junbiao Dai, Qiong Wu, Microgrooved poly(3-hydroxybutyrate-co-3-hydroxyhexanoate) affects the phenotype of vascular smooth muscle cells through let-7a-involved regulation of actin dynamics, Biotechnology Letters,36(10): 2125-2133, 2014.

  • Mengyun Yue, Dong Wu, and Zheyao Wang*, Data compression for image sensor arrays using a 15-bit two-step sigma–delta ADC, IEEE Sensors Journal,14(9): 2989-2998, 2014.

  • Pai Zhao, Ning Deng, Xiaowei Li, Chaochao Ren, Zheyao Wang*, Development of highly-sensitive and ultra-thin silicon stress sensor chips for wearable biomedical applications, Sensors Actuators: A. Physical, 216: 158–166, 2014.

  • Cui Huang, Zheyao Wang*, Planarization of high topography surfaces with deep holes and cavities using two-step polymer coating, Sensors Actuators: A. Physical, 213: 94–101, 2014.

  • Cui Huang, Qianwen Chen, Dong Wu, and Zheyao Wang, Implementation of Air-Gap Through-Silicon-Vias (TSVs) Using Sacrificial Technology, IEEE Trans. Components, Packaging and Manufacturing Technology,3(8): 1430-1438, 2013.

  • Qianwen Chen, Cui Huang, Zhimin Tan, and Zheyao Wang*, Low Capacitance Through-Silicon-Vias (TSVs) with Uniform Benzocyclobutene (BCB) Insulation Layers, IEEE Trans. Components, Packaging and Manufacturing Technology, 3(5), 724-731, 2013.

  • Qianwen Chen, Cui Huang, Dong Wu, Zhimin Tan, and Zheyao Wang*, Ultra-Low Capacitance Through-Silicon-Vias (TSVs) with Annular Air-Gap Insulation Layers, IEEE Trans. Electron Devices, IEEE Trans. Electron Devices , 60(4), 1421-1426, 2013

  • Yuanchao Li, Wenzhou Ruan, and Zheyao Wang*, Localized Synthesis of Carbon Nanotube Films on Suspended Microstructures by Laser-Assisted Chemical Vapor Deposition, IEEE Trans. Nanotechnology, 12(3), 352-360, 2013

  • Cui Huang, Qianwen Chen, Zheyao Wang*, Polymer liner formation in high aspect ratio through-silicon-vias for 3D integration, IEEE Trans. Components, Packaging and Manufacturing Technology, 3(7):1107-1113, 2013.

  • Hua Dang, Yingtao Ding, Zheyao Wang, Cell trapping and patterning using dielectric-structure-assisted negative dieletrophoresis, Science China Technological Sciences., 56(4), 1001-1007, 2013.

  • Qianwen Chen, Wuyang Yu, Cui Huang, Zhimin Tan, Zheyao Wang*, Reliability of TSVs with Benzocyclobutene Liners, Microelectronics Reliability,53, 725-732, 2013.

  • Cui Huang, Qianwen Chen, and Zheyao Wang*, Air-Gap Through-Silicon Vias (TSVs), IEEE Electron Device Letters, 34(3), 441-443, 2013.

  • Wenzhou Ruan, Zheyao Wang*, Yuanchao Li, Litian Liu, A microcalorimeter Integrated with carbon nanotube interface layers for fast detection of trace energetic chemicals, IEEE/ASME Journal of Microelectromechanical Systems, 22(1), 152-162, 2013.

  • Cui Huang, Qianwen Chen, Dong Wu, Zheyao Wang*, High Aspect-Ratio and Low Capacitance Through-Silicon-Vias (TSVs) with Polymer Insulation Layers, Microelectronic Engineering, 104, 12-17, 2013.

  • Wenzhou Ruan, Yuanchao Li, Zhimin Tan, Litian Liu, Kaili Jiang, Zheyao Wang*, In-situ synthesized carbon nanotube networks on a microcantilever for sensitive detection of explosive vapors, Sensors and Actuators B, 176, 141-148, 2013.

  • Qianwen Chen, Cui Huang, Zheyao Wang*, Benzocyclobutene polymer filling of high-aspect-ratio annular trenches for fabrication of through-silicon-vias (TSVs), Microelectronics Reliability, 52(11), 2670-2676, 2012.

  • Wenzhou Ruan, Zheyao Wang, Yuanchao Li, and Litian Liu, In-Situ Heat Capacity Measurement of Carbon Nanotubes Using Suspending Microstructure Based Micro-Calorimetry, IEEE Trans. Nanotechnology, 11(2): 367-373, 2012.

  • Qianwen Chen, Dingyou Zhang, Zhou Fang, Zhimin Tan, Zheyao Wang, Litian Liu, and James J.-Q. Lu. A novel chip-to-wafer (C2W) three-dimensional (3D) integration approach using a template for precise alignment,Microelectronic Engineering, 92(4), 15-18, 2012.

  • Yun Shi, Chaochao Ren, Wei Hao, Min Zhang, Yuxing Bai, Zheyao Wang, An Ultra-Thin Piezoresistive Stress Sensor for Measurement of Tooth Orthodontic Force in Invisible Aligners, IEEE Sensors Journal, 12(5), 1090-1097, 2012.

  • He Zhao, Zheyao Wang, Motion Measurement Using Inertial Sensors, Ultrasonic Sensors, and Magnetometers with Extended Kalman Filter for Data Fusion, IEEE Sensors Journal, 12(5):943-953, 2012.

  • Xiangming Xu and Zheyao Wang, Non-covalent dispersed carbon nanotube - benzocyclobutene composites as bonding interface materials for three-dimensional integration, Microelectronic Engineering, 91:33-38, 2012.

  • Chongshen Song, Zheyao Wang, Zhimin Tan, and Litian Liu, Moving Boundary Simulation and Experimental Verification of High Aspect-Ratio Through-Silicon-Vias for 3D Integration, IEEE Trans. Components and Packaging Technology, 2(1): 23-31, 2012.

  • Xiangming Xu and Zheyao Wang, Thermal Conductivity Enhancement of Benzocyclobutene With Carbon Nanotubes for Adhesive Bonding in 3D Integration, IEEE Trans. Components and Packaging Technology, 2(2): 286 – 293, 2012.

  • Wenzhou Ruan, Zheyao Wang, Litian Liu, Jie Li, and Kaili Jiang, Synthesis of Carbon Nanotubes on Suspending Microstructures by Rapid Local Laser Heating, IEEE Sensors Journal, 11(12): 3424 - 3425, 2011.

  • Qianwen Chen, Dingyou Zhang, Zhou Fang, Zhimin Tan, Zheyao Wang, Litian Liu, and Jian-Qiang Lu, Thick benzocyclobutente (BCB) etching using high density SF6/O2 plasmas, Journal of Vacuum Science and Technology, B, 29(1), 2011, 011019.

  • Xuexin Duan, Myoung-Hwan Park, Yiping Zhao, Erwin Berenschot, Zheyao Wang, David N. Reinhoudt, Vincent M. Rotello, and Jurriaan Huskens, Metal gold nanoparticle wires formed by an integrated nanomolding-chemical assembly process: fabrication and properties, ACS Nano, 2010, 4 (12), pp 7660–7666.

  • Yinghui Sun, Kai Liu, Jiao Miao, Zheyao Wang, Baozhong Tian, Lina Zhang, Qunqing Li, Shoushan Fan, and Kaili Jiang, Highly sensitive surface-enhanced raman scattering substrate made from super-aligned carbon nanotubes, Nano Letters, 10(2010): 1747-1753.

  • Qi Zhang, Wenzhou Ruan, Han Wang, Youzheng Zhou, Zheyao Wang*, and Litan Liu, A self-bended piezoresistive mMicrocantilever flow sensor for low flow rate measurement, Sensors Actuators: A, Physical, 158 (2010), pp. 273-279.

  • Rui Yang, Xin Huang, Wenzhou Ruan, Youzheng Zhou, Zheyao Wang*, Litian Liu, A chemisorption-based microcantilever chemical sensor for detection of trimethylamine, Sensors & Actuators: B, Chemical, 145(2010): 474-479.

  • Qianwen Chen, Zheyao Wang*, Zhiming Tan, Litian Liu, Characterization of reactive ion etching of benzocyclobutente in SF6/O2 plasmas, Microelectronic Engineering, 87(10): 1945-1950, 2010.

  • Qianwen Chen, Zheyao Wang*, Litian Liu. The Influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration. Microelectronic Engineering, 87(3): 527-531, 2010.

  • Chongshen Song, Zheyao Wang*, Litian Liu. Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-vias. Microelectronic Engineering, 87(3): 510-513, 2010.

  • Kuo Tian, Zheyao Wang*, Min Zhang, Litian Liu. Design, fabrication, and calibration of a piezoresistive stress sensor on SOI wafers for electronic packaging applications. IEEE Trans. Components and Packaging Technologies. 32(7): 513-520, 2009.

  • Youzheng Zhou, Zheyao Wang*, Chaonan Wang, Wenzhou Ruan, Litian Liu. Design, fabrication, and characterization of a two-step released silicon dioxide piezoresistive microcantilever immunosensor, Journal of Micromechanics and Microengineering , 19, 065026, 2009

  • Zheyao Wang*, Youzheng Zhou, Chaonan Wang, Wenzhou Ruan, Litian Liu. A Theoretical model for surface-stress piezoresistive microcantilever biosensors with discontinuous layers. Sensors Actuators B: Chemical, 138: 598-606, 2009.

  • Youzheng Zhou, Zheyao Wang*, Qi Zhang, Wenzhou Ruan, Litian Liu. A front-side released single crystalline silicon piezoresistive microcantilever sensor. IEEE Sensors Journal. 9(3)：246-254, 2009.

  • Chongshen Song, Zheyao Wang*, Qianwen Chen, Jian Cai, Litian Liu. High aspect ratio copper through-silicon-vias for 3D integration. Microelectronic Engineering, 2008, 85: 1952-1956

  • Zheyao Wang*, Kuo Tian, Youzheng Zhou, Liyang Pan, Chaohong Hu, Litian Liu. A high temperature silicon-on-insulator stress sensor. Journal of Micromechanics and Microengineering. 18(4), 045018, 2008.

  • Chao Wang, Zheyao Wang*, Tianling Ren, Yiping Zhu, Yi Yang, Xiaoming Wu, Haining Wang, Hujun Fang, Litian Liu. A micromachined piezoelectric ultrasonic transducer operating in d33 mode using square interdigital electrodes. IEEE Sensors Journal, 7(7): 967-976, 2007.

  • Wang C, Ren TL, Wang ZY, et al. Fabrication and characterization of in-plane polarized PZT films with interdigital electrodes. Integrated Ferroelectrics, 88: 3-11 2007.

  • Chao Wang, Zheyao Wang*, Tianling Ren, Litian Liu. Design and Simulation of a Novel Operation Mode of Integrated Ferroelectric Micro-Sensors, Integrated Ferroelectrics, 78: 59-67, 2006.

  • Xuefeng Zeng, Ruifeng Yue, Jiangang Wu, Huan Hu, Liang Dong, Zheyao Wang, Feng He, Litian Liu. Droplet creator based on electrowetting-on-dielectric for lab on a chip. Science in China Series E: Tech Sciences, 49 (2): 248-256 APR 2006.

  • Wu Jiangang, Yue RF, Zeng Xuefeng, Kang Ming, Hu Huan, Zheyao Wang, Liu Litian. Studies on digital microfluidic chip for micro-total-analysis systems.Chinese Journal of Analytical Chemistry, 34 (7): 1042-1046 JUL 2006.

  • Zheyao Wang*, Huan Hu, Yu Wang, Yawu Wang, Qiong Wu, Litian Liu, Guoqiang Chen, Soft lithography techniques for the fabrication of poly(3-hydroxybutyrate-co-3-hydroxyhexanoate) scaffolds, Biomaterials, 27(12), Apr.2006, 2550-2557.

  • Zheyao Wang*, Jianshe Liu, Litian Liu, Zhijian Li, Permittivity Measurement of Ba0.5Sr0.5TiO3 Thin Films on Multi-Layered Silicon Substrates, IEEE Trans. Instrumentation and Measurement. 55(1), 2006, 350-356.

  • Zheyao Wang, Lianwei Wang, N. T. Nguyen, Wim A.H. Wien, Hugo Schellevis, Pasqualina M. Sarro, Joachim N. Burghartz. Silicon Micromachining of High-Aspect Ratio, High-Density Through-Wafer Electrical Interconnects for 3D Multichip Packaging, IEEE Trans. on Advanced Packaging, 29(3), 615-622, 2006.

  • Jiashi Yang, Honggang Zhou, Zheyao Wang, Vibrations of an Asymmetrically Electroded Piezoelectric Plate, IEEE Trans. on Ultrasononics, Ferroelectrics, and Frequency Control. 52(11), 2031-2038, 2005.

  • Zheyao Wang, Chao Wang, Litian Liu, Design and Analysis of A PZT-Based Micromachined Acoustic Sensor with Increased Sensitivity, IEEE Trans. on Ultrasononics, Ferroelectrics, and Frequency Control, 52(10), Oct, 2005, 1840-1850.

  • Zheyao Wang, Huan HU, Analysis and Optimization of a Compliant Mechanism-Based Digital Force/Weight Sensor, IEEE Sensors Journal, 5(6), Dec. 2005, 1243 – 1250.

  • Zheyao Wang, Ruifeng Yue, Ruoxin Zhang, Litian Liu, Design and optimization of laminated piezoresistive microcantilever sensors, Sensors and Actuators. A, 120(2), 2005: 325-336.

  • Zheyao Wang, Jianshe Liu, Tianling Ren, Litian Liu, Fabrication of organic PVP doping-based Ba0.5Sr0.5TiO3 thick films on silicon substrates for MEMS applications, Sensors and Actuators. A, 2005, 117(2): 293-300.

  • Zheyao Wang, etc, Creep characteristics of combined bulk acoustic wave quartz resonator force sensors, Sensors and Actuators. A, 2004,Mar 111(2-3): 203-209.

  • Zheyao Wang, etc, Effect of Transverse Loading on Performance of BAW Quartz Resonator Force Sensors, IEEE Trans. on Ultrasononics, Ferroelectrics, and Frequency Control, 2004, 51(4): 470-476.

  • Zheyao Wang, etc, Development of a High Resolution Quartz Resonator Force and Weight Sensor with Increased Reliability, IEEE Trans. on Mechatronics, 9 (2): 399-406, 2004.

  • Zheyao Wang, etc. A thickness-shear quartz resonator force sensor with dual-mode temperature compensation, IEEE Sensors Journal. 2003, 3 (4): 490-496.

  • Zheyao Wang, etc, Force-frequency coefficient of symmetrical incomplete circular quartz crystal resonator, IEEE Trans. on Ultrasononics, Ferroelectrics, and Frequency Control, 2001, 48(5), 1471-1479.

  • Zheyao Wang, etc, An off-center load insensitive digital quartz resonator force sensor based on energy trapping effect, IEE Proceeding Science Measurement Technology, 2001, 148(5), 215-220.

  • Zheyao Wang, etc, A temperature insensitive quartz resonator force sensor, Measurement Science and Technology, 2000, 11(11), 1565-1569.

International Conference Articles

  • Zheyao Wang, Three-dimensional integration for MEMS and microsensors. 44th Micro and Nano Engineering Conference, 2018, Invited talk , 2018.

  • Hao Xiong, Zheyao Wang, Fabrication of Chalcogenide Infrared Microlens Array Using Hot Embossing Method. IEEEE Sensors Conf 2018 , 1-3, 2018.

  • Zhida Zhao, Kun Zhou, Liyang Pan, Zheyao Wang, Fabrication of silicon nanowire sensors using CMOS technologies. Intl. Meeting on Chemical Sensors , 2018.

  • Kun Zhou; Zhida Zhao; Zheyao Wang, Fabrication of silicon nanowire pH sensors using high output, low cost sidewall mask technology. 2017 IEEE SENSORS , 1-3, 2017.

  • Qing Ma; Kaitian Huang; Zhanqing Yu; Zheyao Wang, An electric field sensor with double-layer floating structure for measurement of dc synthetic field coupled with ion flow. 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) , 890 – 893, 2017.

  • Xingjun Xue; Shujie Yang; Dong Wu; Liyang Pan; Zheyao Wang*, Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive. 2016 IEEE Sensors Conference , 2016.

  • Ke Wu; Zheyao Wang; A novel manufacturing scheme for TSVs with porous polymer insulation liners. 2016 17th International Conference on Electronic Packaging Technology (ICEPT) , 1262 - 1266, 2016.

  • Qing Ma; Zheyao Wang; Liyang Pan. Monolithic integration of multiple sensors on a single silicon chip. 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) , 2016.

  • Zhanqing Yu; Kaitian Huang; Rong Zeng; Zhiye Gao; Min Li; Lei Liu; Bin Lou; Qing Ma; Zheyao Wang; Bo Zhang; Jinliang He. Research on DC electric field measurement considering ion flow near HVDC transmission line. 12th IET International Conference on AC and DC Power Transmission (ACDC 2016) , 2016.

  • Zhen Song, Yuxin Du, Miao Liu, Shujie Yang, Dong Wu, Zheyao Wang. Three-dimensional integration of suspended single-crystalline silicon MEMS arrays with CMOS. IEEE MEMS , 2015.

  • Cui Huang, Dong Wu and Zheyao Wang. Thermal and Electrical Tests of Air-Gap TSV. IEEE ECTC , 1722-1728, 2014.

  • Hao Tang, Shouhong Jin, Qiong Wu, Zheyao Wang*. A Microplatform for Measurement of Cell Mechanical Properties. IEEE Sensors Conference , 2014

  • Pai Zhao, Ning Deng, and Zheyao Wang*. Fabrication of ultra-thin silicon stress sensor chips with high flexibility and high sensitivity. IEEE Sensors Conference , 2014

  • Qianwen Chen, Huang Cui, Zheyao Wang*. Development of Ultra-Low Capacitance Through-Silicon-Vias(TSVs) with Air-gap Liner. IEEE ECTC , 1433-1438, 2013.

  • Wenzhou Ruan, Yuanchao Li, and Zheyao Wang. A microcalorimeter with In-situ synthesized Nanotube adsorber for Trace Energetic Substance detection. Transducers’13

  • Qianwen Chen, Zheyao Wang*, James Lu. Measurement and simulation of thermal-induced stress in C2W 3D integration with template alignment. ECS Transactions , 44(1), 727-736, 2012.

  • Wenzhou Ruan, Zheyao Wang, Yuanchao Li, Zhimin Tan, and Litian Liu. Trace detection of energetic substances using silicon dioxide microbridge-based micro-calorimetric sensors. ECS Transactions , 44(1), 1353-1359, 2012, Oral

  • Qianwen Chen, Dingyou Zhang, Zheyao Wang, James Jian-Qiang Lu. Chip-to-Wafer (C2W) 3D Integration with Well-Controlled Template-Alignment and Wafer-Level Bonding. IEEE 61st Electronic Components and Technology Conference (ECTC) , 2011.

  • Youzheng Zhou, Zheyao Wang, Wentao Yue, Kai Tang, and Litian Liu. Label-free Detection of p53 Antibody Using A Microcantilever Biosensor With Piezoresistive Readout. IEEE Sensors Conference, 2009.

  • Qianwen Chen, Zheyao Wang, Litian Liu. The Influence of Ultrasonic Agitation on Copper Electroplating of Blind-Vias for SOI Three-Dimensional Integration. 2009 15th Materials for Advanced Metallization, Accepted.

  • Chongshen Song, Zheyao Wang*, Litian Liu. Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-vias. 2009 15th Materials for Advanced Metallization, Accepted.

  • Youzheng Zhou, Qi Zhang, Zheyao Wang, Litian Liu. A Silicon Microcantilever Biosensor Fabricated on SOI Wafers Using a Two-Step Releasing Approach. IEEE Sensors Conference, 2008, 227-230.

  • Chongshen Song, Zheyao Wang, Qianwen Chen, Jian Cai, Litian Liu. High aspect ratio copper through- silicon- vias for 3D integration. 2008 14th Materials for Advanced Metallization.

  • Zhu, Yi-Ping; Ren, Tian-Ling; Wang, Chao; Wang, Zhe-Yao; Liu, Li-Tian; Li, Zhi-Jian;Novel In-Plane Polarized PZT Film Based Ultrasonic Micro-Acoustic Device. International Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007.10-14 June 2007:1291 – 1294 (SCI: BGP86)

  • Wang, Jinpeng; Hu, Huan; Wang, Zheyao; Liu, Litian; Numerical Analysis and Optimization of Insulator-based Dielectrophoresis Devices for Cell Sorter Applications. 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2007. NEMS '07. Jan. 2007:1048 – 1051(SCI: BGN46)

  • Huan Hu; Zhe-yao Wang; Rui-feng Yue; Li-tian Liu;Design and Optimization of a Microfluidic Cell Separator Based on Dielectrophoresis. 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 18-21 Jan. 2006:1113 – 1116 (SCI: BGM58)

  • Zheyao Wang; Jianshe Liu; Tianling Ren; Litian Liu; Zhijian Li; Ba/sub 0.5/Sr/sub 0.5/TiO/sub 3/ ferroelectric thick films with uniform thickness and its applications to RF MEMS devices, Proceedings of the 13th IEEE International Symposium on Applications of Ferroelectrics, ISAF 2002. 28 May-1 June 2002, 475 – 478.

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